Lingshu Zhifu raises over 10 million yuan in back-to-back seed and angel rounds to fund pilot production line for flexible tactile sensing materials.
Amount Raised
¥10 Million
Round Type
Seed
ShanghaiManufacturingRoboticsDescription
Lingshu Zhifu Electronic Technology Co., Ltd. has closed back-to-back seed and angel funding rounds, raising more than 10 million yuan in total. The company, founded in April 2025 by Jia Wei, develops flexible tactile sensing materials and devices using ionic skin technology. Proceeds will primarily fund the construction of a pilot production line for materials and customer sampling
Quick answer
Lingshu Zhifu Electronic Technology Ltd raised ¥10 Million in a Seed round, dated November 4, 2026. Lingshu Zhifu Electronic Technology Ltd is based in Shanghai, China.
- How much did Lingshu Zhifu Electronic Technology Ltd raise?
- Lingshu Zhifu Electronic Technology Ltd raised ¥10 Million in a Seed round on November 4, 2026.
- What does Lingshu Zhifu Electronic Technology Ltd do?
- Lingshu Zhifu Electronic Technology Co., Ltd. specializes in flexible tactile sensing materials and devices using ionic skin technology.
- Where is Lingshu Zhifu Electronic Technology Ltd based and how big is it?
- Lingshu Zhifu Electronic Technology Ltd is based in Shanghai, China.
Source: Fundz verified event record.
Who else raised in Robotics and Manufacturing around the same time
Companies in the same sectors as Lingshu Zhifu Electronic Technology Ltd that raised within 45 days of this round, from Fundz verified event records.
- Mosaic Intelligence Labs raised $47M (Seed) on November 10, 2026.
- Strive Robotics raised $3M (Pre-Seed) on November 5, 2026.
- Aformic raised $7M (Seed) on November 4, 2026.
- Peppermint Robotics raised $11M (Series B) on November 4, 2026.
- Foundry Robotics raised $100M (Series A) on October 28, 2026.
- Realbotix raised $500K (Debt Financing) on October 23, 2026.
Who to call at Lingshu Zhifu Electronic Technology Ltd, and when
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Lingshu Zhifu Electronic Technology Ltd raised. Fundz records a round at a median of 3.6 minutes from the SEC filing, with the decision-maker attached.
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