3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional passive radio frequency (RF) devices, announced today it has raised an additional $4 million in an extended Series B1 funding round. 3DGS welcomed new investor Menlo Microsystems Inc., as well as follow-on investments from both Corning Incorporated (NYSE: GLW) and Sun Mountain Capital, bringing the total Series B1 raise to $24 million.
Quick answer
3 D Glass Solutions raised $4 Million in a Series B round, dated January 31, 2022. 3 D Glass Solutions is based in Albuquerque, New Mexico, United States.
How much did 3 D Glass Solutions raise?
3 D Glass Solutions raised $4 Million in a Series B round on January 31, 2022.
What does 3 D Glass Solutions do?
3D Glass Solutions (3DGS) is a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics.
Where is 3 D Glass Solutions based and how big is it?
3 D Glass Solutions is based in Albuquerque, New Mexico, United States.
Source: Fundz verified event record.
Who else raised in Hardware and Consumer Electronics around the same time
Companies in the same sectors as 3 D Glass Solutions that raised within 45 days of this round, from Fundz verified event records.
RoboSense raised an undisclosed amount (Corporate Round) on December 27, 2021.
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Company Information
Company
3 D Glass Solutions
Location
Albuquerque, New Mexico, United States
About
3D Glass Solutions (3DGS) is a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics. The company manufactures a wide variety of glass-based, system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® glass ceramic technology for applications in RF electronics and photonics used in automotive radar, IC electronics, medical, aerospace, defense, wireless infrastructure, mobile handset and IoT industries. 3DGS offers high-precision products with exceptional high-frequency and low-loss properties. 3DGS glass ceramic-based RF products can be combined with any number of designs or devices to create incredibly unique and valuable SiP products. The company has created foundational patent positions related to all photosensitive glass-ceramic materials and devices and owns the fundamental intellectual property for all four positions (materials, design, systems and manufacturing) related to glass-ceramic devices for the electronics packaging industry. 3DGS leverages its unique product solutions to provide device manufacturing and systems integration services for several standard and custom products. To learn more about 3DGS, visit www.3DGSinc.com.
APEX® is a registered trademark of 3D Glass Solutions Inc.
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